Caractéristiques et avantages
- Innovative silver-coated ceramic formulation for cost-effective electrical conductivity.
- Forms strong bonds between various substrates, enhancing versatility.
- Cures at room temperature or can be accelerated with mild heat.
- Ideal for applications like EMI/RFI shielding and printed circuit board assembly.
- User-friendly creamy consistency allows for multiple application methods.
- Excellent performance with low volume resistivity and high tensile strength.

